Direct Bonded Copper Ceramic Substrate

Direct Bonded Copper Ceramic Substrate

DBC ceramic substrate, short for "direct bonded copper ceramic substrate," is an advanced material consisting of a ceramic substrate (usually Al2O3 or AlN) and copper tightly bonded together through a hypoeutectic process. This unique combination of materials produces a substrate with exceptional thermal conductivity, low thermal expansion, high strength, and excellent wettability for soldering.

Material properties of direct bonded copper-ceramic substrates

• Low thermal expansion

• High strength

• High thermal conductivity

• High solder wettability

Applications of direct bonded copper-ceramic substrates

• Power electronics: IGBT, MOSFET, thyristor module, solid-state relay, diode, power transistors
• Automotive: ABS, power steering, DC/DC converter, LED lighting, ignition control system
• Household appliances: air conditioner, Peltier cooler
• Environmental technologies: Local power generation, electric vehicles, traction control systems, photovoltaic units, wind energy
• Industry: LED displays, welding machines
• Aerospace: laser, power source for satellites and aircraft
• PC/IT: power supply, UPS system