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DPC technology (Direct Plated Copper)

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DPC technology (Direct Plated Copper)

DPC technology (Direct Plated Copper)
DPC technology (Direct Plated Copper)

큰 이미지 :  DPC technology (Direct Plated Copper)

제품 상세 정보:
원래 장소: 중국
브랜드 이름: ZG
인증: CE
모델 번호: MS
결제 및 배송 조건:
최소 주문 수량: 1개
가격: 10USD/PC
포장 세부 사항: 글로벌 배송을 위한 튼튼한 나무 상자
배달 시간: 5-8 근무일
지불 조건: L/C, D/A, D/P, T/T, 서부 동맹, MoneyGram
공급 능력: 1000 PC

DPC technology (Direct Plated Copper)

설명
강조하다:

Direct Plated Copper ceramic parts

,

DPC technology ceramic components

,

Technical ceramic parts with DPC

DPC technology (Direct Plated Copper)

 

Stapes of the technological process:

 

1. Formation of a thin continuous film of conductive material on a ceramic substrate. In this case, there may be holes in the substrate;

 

2. Applying a photoresist to the formed conductive layer;

 

3. Exposure and manifestation of photoresist;

 

4. Galvanic build-up of copper metallization of the required thickness;

 

5. Application of Ni-Au finish coating;

 

6. Removing the photoresist from the surface of the board;

 

7. Chemical etching of the conductive layer remaining on the ceramic after removing the photoresist.

 

Specifications

Properties

Thick-film technology

DPC

Tolerance

± 10%

± 1%

Adhesion

high

high

Surface roughness Ra, mkm

от 1 до 3

≤ 0,3

Pages DPC technology (Direct Plated Copper) 0 DPC technology (Direct Plated Copper) 1
 
 

Technology comparance (the 5 - the best items, the 1 - the lowest items)

 

Properties

DPC

Thin- film technology

Thick-film technology

Electrical conductivity

5

3

4

Thermal conductivity

5

3

4

Stability of parameters

5

5

3

Resolution

4..5

(определяется толщиной медного слоя)

5

2

Cost

5

2

2

 

 

Ceramics

Thickness, mkm

Conductive material of the transition holes

Tolerance for the width of the conductor, microns

Cu

Ni

Au

Al2O3

1... 100

3 ... 5

0,075... 1

Ag, Cu

50

AlN

 

 

 

An equally important characteristic that determines the durability of products is the resistance of the metallized board to temperature effects. Thermal cycling testing was carried out according to MIL-STD-202.107G. This method is designed to determine the stability of a ceramic substrate with metallization to a cyclic temperature change.

Test conditions:

 

  • -400C (30 min)~1250 oC (30 min), 500 cycles;
  • adhesion measurement method: bursting machine;
  • conditions: adhesion ≥ 3 kg.

 

 

 

Test results

 

Value, кг

Results

Value, кг

Results

1

3,84

+

6

3,94

+

2

3,92

+

7

4,11

+

3

4,02

+

8

3,51

+

4

3,76

+

9

3,87

+

5

3,58

+

10

4,01

+

Average adhesion value, кг: 3,86 ± 0,18

Application area

  • solar collectors;
  • power electronics:
  • power integrated circuits;
  • thermoelectric coolers and generators;
  • microwave appliances;
  • Microwave devices;
  • LED leds.

DPC technology (Direct Plated Copper) 2

연락처 세부 사항
HENAN ZG INDUSTRIAL PRODUCTS CO.,LTD

담당자: Daniel

전화 번호: 18003718225

팩스: 86-0371-6572-0196

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